Global Event Promotion

   Event Type Conference    
 

Nov 24th 2018




To

Nov 26th 2018

IEEE--2018 The 3rd International Conference on Integrated Circuits and Microsystems (ICICM 2018)--Ei and Scopus  
Event Serial - ACA210868
Website   http://www.icicm.net/
Contact Person - Ms Sissi Chan
Event enquiries email address - icicm@young.ac.cn
Deadline for abstracts/proposals: 2018-09-30
Organized by: ICICM
Venue: Shanghai, Shanghai, China

About Event

The previous 2 editions ICICM were sponsored by IEEE and it has been successfully held in Chengdu on November 23-25, 2016 and Nanjing on November 8-11, 2017. The 3rd International Conference on Integrated Circuits and Microsystems (ICICM 2018) will be held on November 24-26, 2018 in Shanghai, China with the support from University of Electronic Science and Technology of China and Southeast University, China.